Package Layout Engineer - [REY-85]

Package Layout Engineer - [REY-85]

27 May
|
Micron Semiconductor Asia Pte Ltd
|
Hyderābād

27 May

Micron Semiconductor Asia Pte Ltd

Hyderābād

Do you like to work on groundbreaking technologies that span mobile, consumer and high-performance applications? Are you looking to lead and strengthen a team of experts who will get to work on products that impact billions of people? We are looking for a hardworking Semiconductor Packaging Master Designer to join our global team.



As a package designer at Micron Technology, Inc., you will be responsible for the layout and design of effective package layouts that meet outstanding technical standards. You will own and drive advanced package design and layout in a timely manner – and have ultimate responsibility for package/SIP layout, optimization, layout verification and taping out.



Qualifications:







- Bachelors or advanced degree in Electrical or Mechanical or Electronics Engineering with significant technical experience

- Minimum 3+ years hands on experience with Cadence APD/SIP or equivalent mentor tools is a must

- Minimum 2+ years’ experience in packaging area including Wirebond & Flip chip technologies.

- Experience preferred in schematic capture, layout and design using Cadence Allegro Schematic Design Entry (Concept HDL) design tools is required

- Ability to travel internationally as required





Responsibilities:





Build Package Designs



- Execute advanced package design reviews in a timely and efficient manner

- Design for optimum electrical performance, manufacturability, and package reliability

- Perform direct design reviews with assembly subcon design teams

- Participate in the DFMEA (Design for Manufacturing) process





Generate Documentation





- Maintain familiarity with documentation work flows and signoff flows

- Ensure accurate and timely update of all documents into the Assembly Database

- Check and proofread designs from different areas (interposer suppliers, subcons drawings, tooling vendor, etc.

- Provide accurate drafting support for the following drawings: Marketing Drawings, Manufacturing Drawings, Package Outline Drawings, Interposer Drawings, and WireBond Diagrams.

The original job offer can be found in Kit Job:
https://www.kitjob.in/job/22778127/package-layout-engineer-rey-85-hyderabad/?utm_source=html

Reply to this offer

Impress this employer describing Your skills and abilities, fill out the form below and leave Your personal touch in the presentation letter.

Subscribe to this job alert:
Enter Your E-mail address to receive the latest job offers for: package layout engineer - [rey-85]
Publish a new Free Offer
Need to publish an offer? With more than 1 million unique users per month, you will find the ideal candidate for your company instantly, what are you waiting for!
Publish Now

Subscribe to this job alert