Micron Semiconductor Asia Pte Ltd
Do you like to work on groundbreaking technologies that span mobile, consumer and high-performance applications? Are you looking to lead and strengthen a team of experts who will get to work on products that impact billions of people? We are looking for a hardworking Semiconductor Packaging Master Designer to join our global team.
As a package designer at Micron Technology, Inc., you will be responsible for the layout and design of effective package layouts that meet outstanding technical standards. You will own and drive advanced package design and layout in a timely manner – and have ultimate responsibility for package/SIP layout, optimization, layout verification and taping out.
- Bachelors or advanced degree in Electrical or Mechanical or Electronics Engineering with significant technical experience
- Minimum 3+ years hands on experience with Cadence APD/SIP or equivalent mentor tools is a must
- Minimum 2+ years’ experience in packaging area including Wirebond & Flip chip technologies.
- Experience preferred in schematic capture, layout and design using Cadence Allegro Schematic Design Entry (Concept HDL) design tools is required
- Ability to travel internationally as required
Build Package Designs
- Execute advanced package design reviews in a timely and efficient manner
- Design for optimum electrical performance, manufacturability, and package reliability
- Perform direct design reviews with assembly subcon design teams
- Participate in the DFMEA (Design for Manufacturing) process
- Maintain familiarity with documentation work flows and signoff flows
- Ensure accurate and timely update of all documents into the Assembly Database
- Check and proofread designs from different areas (interposer suppliers, subcons drawings, tooling vendor, etc.
- Provide accurate drafting support for the following drawings: Marketing Drawings, Manufacturing Drawings, Package Outline Drawings, Interposer Drawings, and WireBond Diagrams.
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