Module Lead Embedded Software Engineer - Datapath - WML-615

Module Lead Embedded Software Engineer - Datapath - WML-615

07 Jun
|
Ciena India Pvt Ltd
|
Gurgaon district

07 Jun

Ciena India Pvt Ltd

Gurgaon district

Job Description



We are a network strategy and technology company that is motivated by making a difference in people lives their productivity, their creativity, their health and comfort. Thats why our engineers design and implement technologies that allow people to do great things.



With customer proven capabilities, the Ciena Packet Transport Team is enhancing and advancing Carrier Ethernet Solutions to take advantage of worldwide market opportunities as Service Providers virtualize their networks, unify their legacy networks, and prepare for 5G.



Were looking for motivated and talented individuals with extensive experience implementing carrier-grade data communications services.

You will take an experienced and influential role contributing to Layer2/Layer3 data-path architecture, infrastructure and features, delivering innovative solutions to meet demanding performance, scalability and feature requirements for carrier grade Ethernet services.





What will you do at Ciena?



Drive the development of Packet Dataplane centric features and capabilities in areas of L2/L3 forwarding, Traffic Management - Ingress/Egress QoS/H-QOS etc.

Drive the development of advanced routing, service features and capabilities in a switching/routing system involving advanced routing: OSPF, IS-IS, BGP-PIC, Segment Routing, IP-VPN, EVPN, Ethernet services and network virtualization.

Work on highly complex systems involving fabric based multi-line card hybrid architecture that support high-availability, carrier-grade requirement of scale and performance.

Author and contribute in software design, development, reviews, validation, and documentation to deliver high quality, functionally excellent products.

Provide basic status reporting for feature of ownership.





Required Skills:



Working knowledge in areas of L2/MPLS/IP packet forwarding on networking devices.

Good understanding of BCM chipset in areas of L2/L3 packet processing pipeline forwarding engine, traffic management, injection/extraction etc.

Good knowledge of working of Broadcom SDK API's and internal for XGS/DNX family based chipsets.

Exposure to L2/L3 control protocols (e.g. LLDP, LACP, CFM, Y.1731, G.8032, BFD, BGP, RSVP-TE, 6PE, 6vPE etc.) is a plus.

Strong C programming skills with strong debugging and trouble shooting skills over Linux platform.

Exposure to end-to-end feature development including CLI, SNMP/Netconf, inter module/thread communication.

Knowledge of IP networking stack in Linux & IP routing is add on advantage.

Carrier class product design and delivery experience with Access & Aggregation Switches/Routers designed for Service Provider deployments.

Exposure to traffic generators such as Ixia (IxNetwork, IxExplorer) or Spirent (Spirent TestCenter) is added advantage.

Understanding of IPv4 and IPv6 protocol family

Understanding around In Service Software Upgrade (ISSU)

Understanding of distributed system and architecture

Demonstrable self-initiative and can do attitude to find and implement the best solutions for customers.

Effectively able to work independently with little supervision and delivering to aggressive timelines.

The original job offer can be found in Kit Job:
https://www.kitjob.in/job/22923378/module-lead-embedded-software-engineer-datapath-wml-615-gurgaon-district/?utm_source=html

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