Role Overview

We are looking for a seasoned semiconductor expert to drive deployment and evolution of next-generation 3DIC design and signoff solutions for advanced packaging, chiplet-based architectures, HBM, and heterogeneous integration.

This role requires close collaboration with R&D;, Product Engineering, and strategic customers to solve complex design challenges, influence product direction, and enable successful adoption of cutting-edge 3DIC technologies.

Key Responsibilities

- Drive technical engagements involving 3DIC implementation and system-level signoff methodologies.
- Partner with R&D; to define, validate, and enhance next-generation product capabilities.
- Develop and deploy best-practice flows for multi-die, chiplet, and advanced packaging designs.
- Analyze and debug customer designs involving implementation, timing, power, reliability, and package-aware challenges.
- Influence product roadmap through customer feedback, competitive insights, and technology trends.
- Mentor internal teams and serve as a technical authority for strategic customer engagements.

Required Expertise

Candidates should demonstrate deep expertise in both:





- 3DIC Implementation
- Multi-die/chiplet integration
- Floorplanning and partitioning
- Physical design closure
- Package-aware implementation
- Advanced packaging methodologies
- 3DIC System Signoff
- Timing signoff
- Power integrity and EMIR
- Reliability signoff
- Package-die co-analysis
- Signoff closure for advanced-node designs

Desired Exposure

Working knowledge of one or more MultiPhysics domains:

- Thermal analysis
- Electro-thermal analysis
- Package reliability and warpage

Preferred Background

- 15+ years in semiconductor design, EDA, product engineering, or signoff methodologies.
- Strong experience with advanced-node SoCs, chiplets, HBM, 2.5D/3DIC, or advanced packaging technologies.

Ideal Candidate

A hands-on technical leader who has successfully driven 3DIC implementation and signoff for production silicon, understands emerging chiplet ecosystems, and can bridge customer challenges with product innovation while maintaining robust technical depth as an individual contributor.

📌 Architect – 3DIC Compiler & System Signoff (Bengaluru)
🏢 Synopsys
📍 Bengaluru