We are seeking a seasoned Signal and Power Integrity Engineer with expertise or significant interest in System SIPI. As a member of this team you will ensure the performance requirements of the silicon and the cost requirements of the product are met through the integration of silicon, package and platform electrical design. Packaging Signal Integrity also provides design support to engineering design teams for both current and forward-looking product development and feasibility studies.
The Person:
The ideal candidate has the ability to communicate effectively and work in close collaboration with others in AMD as well as with AMD s customers to ensure optimal engineering design decisions and efficient problem solving, Candidate need to collaborate and work harmoniously with others, while maintaining the ability to work independently.
Key Responsibilities:
- Responsible for Signal Integrity and Power Integrity simulations at feasibility, pre-layout, post-layout phases of AECG characterization board and demo board design. Establish design and layout guidelines.
- Responsible for coordinating with HW design team, layout team, NPI and manufacturing vendors to resolve SI/PI related issues.
- Responsible for end-to-end channel simulations for multi gigabit serial lines like 56Gbps, 112Gbps and beyond.
- Responsible for PI analysis simulations of HBM/DDR4/LPDDR4/DDR5/LPDDR5 and other memory buses.
- Responsible for characterizing the various interfaces in the product and verifying the simulations against measurements.
- Responsible for preparation of and implementing checklists for various stages of PCB development.
- Worked with architecture team, package design team and PCB design team for future PCB technology.
- Update the SIPI design and analysis flow and automate the process.
Preferred Experience:
- 8+ years of skilled experience as Signal and Power Integrity Engineer
- Excellent analytical and problem-solving skills along with attention to details
- Must be a self-starter, able to drive tasks independently and efficiently to completion
- Strong/effective communication skills
- Enthusiastic team-first mentality
- Experience with PCB, Package and IC level power delivery networks
- Experience in silicon packaging and PCB design for signal and power integrity
- Experience with high-speed digital signaling interfaces such as PCIE, DDR5/DDR6, HDMI
- Expertise in electrical modeling EDA and AMS tools such as HFSS, SIwave, HSPICE
- Expertise in electromagnetic theory and circuit analysis
Academic Credentials:
Undergrad/ Masters in Electrical or Electronics Engineering
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