Role Overview
We are looking for a seasoned semiconductor expert to drive deployment and evolution of next-generation 3DIC design and signoff solutions for advanced packaging, chiplet-based architectures, HBM, and heterogeneous integration.
This role requires close collaboration with R&D;, Product Engineering, and strategic customers to solve complex design challenges, influence product direction, and enable successful adoption of cutting-edge 3DIC technologies.

Key Responsibilities
Drive technical engagements involving 3DIC implementation and system-level signoff methodologies.
Partner with R&D; to define, validate, and enhance next-generation product capabilities.
Develop and deploy best-practice flows for multi-die, chiplet, and advanced packaging designs.
Analyze and debug customer designs involving implementation, timing, power, reliability, and package-aware challenges.
Influence product roadmap through customer feedback, competitive insights, and technology trends.
Mentor internal teams and serve as a technical authority for strategic customer engagements.

Required Expertise
Candidates should demonstrate deep expertise in both :




3DIC Implementation
Multi-die/chiplet integration
Floorplanning and partitioning
Physical design closure
Package-aware implementation
Advanced packaging methodologies
3DIC System Signoff
Timing signoff
Power integrity and EMIR
Reliability signoff
Package-die co-analysis
Signoff closure for advanced-node designs
Desired Exposure

Working knowledge of one or more MultiPhysics domains:
Thermal analysis
Electro-thermal analysis
Package reliability and warpage

Preferred Background
15+ years in semiconductor design, EDA, product engineering, or signoff methodologies.
Strong experience with advanced-node SoCs, chiplets, HBM, 2.5D/3DIC, or advanced packaging technologies.

Ideal Candidate
A hands-on technical leader who has successfully driven 3DIC implementation and signoff for production silicon , understands emerging chiplet ecosystems, and can bridge customer challenges with product innovation while maintaining solid technical depth as an individual contributor.

📌 Architect – 3DIC Compiler & System Signoff (Bengaluru)
🏢 Synopsys
📍 Bengaluru