Role Overview

We are looking for a seasoned semiconductor expert to drive deployment and evolution of next-generation 3DIC design and signoff solutions for advanced packaging, chiplet-based architectures, HBM, and heterogeneous integration.

This role requires close collaboration with R&D;, Product Engineering, and strategic customers to solve complex design challenges, influence product direction, and enable successful adoption of cutting-edge 3DIC technologies. Key Responsibilities

Drive technical engagements involving 3DIC implementation and system-level signoff methodologies.

Partner with R&D; to define, validate, and enhance next-generation product capabilities.

Develop and deploy best-practice flows for multi-die, chiplet, and advanced packaging designs.

Analyze and debug customer designs involving implementation, timing, power, reliability, and package-aware challenges.

Influence product roadmap through customer feedback, competitive insights, and technology trends.

Mentor internal teams and serve as a technical authority for strategic customer engagements.

Required

Expertise

Candidates should demonstrate deep expertise in both:





3DIC Implementation

Multi-die/chiplet integration

Floorplanning and partitioning

Physical design closure

Package-aware implementation

Advanced packaging methodologies

3DIC System Signoff

Timing signoff

Power integrity and EMIR

Reliability signoff

Package-die co-analysis

Signoff closure for advanced-node designs

Desired Exposure Working knowledge of one or more MultiPhysics domains:

Thermal analysis

Electro-thermal analysis

Package reliability and warpage Preferred Background

15+ years in semiconductor design, EDA, product engineering, or signoff methodologies.

Robust experience with advanced-node SoCs, chiplets, HBM, 2.5D/3DIC, or advanced packaging technologies.

Ideal

Candidate A hands-on technical leader who has successfully driven 3DIC implementation and signoff for production silicon, understands emerging chiplet ecosystems, and can bridge customer challenges with product innovation while maintaining robust technical depth as an individual contributor.

📌 Architect – 3dic Compiler & System Signoff Bengaluru
🏢 Synopsys
📍 Bengaluru