Role & responsibilities

Around 15 years of extensive hands-on experience in high-speed PCB simulation, with a proven track record of successfully delivering complex projects with deadlines

- Team leadership and management: Lead, mentor, and develop simulation team for signal integrity, power integrity, electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents. Manage workload, project allocation, and career growth for team members.
- Simulation strategy and roadmap: Define and implement simulation methodologies and best practices for accuracy, efficiency, optimizations and recommendations across all PCB simulation projects.
- Technical oversight and guidance: Provide technical direction on simulation tasks and result interpretations on signal integrity (SI) for high-speed interfaces like DDR and PCIe, power integrity (PI) for efficient power delivery, electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal management.
- Design review and validation: Conduct design and simulation reviews, providing strategic recommendations to optimize PCB performance and reliability.
- Cross-functional collaboration: Work closely with global hardware, mechanical, and manufacturing teams to translate product requirements into viable PCB designs and simulations. Communicate with cross-functional teams, customers and suppliers on simulation results and design risks.
- Continuous improvement: Drive innovation and improvement in the PCB simulation process.



Stay current with emerging technologies, design standards (e.g. IPC), and simulation tools to enhance efficiency and maintain a competitive edge.
- Project and resource management: Independent management of multiple complex PCB simulation projects simultaneously, ensuring projects meet deadlines, budget requirements, and performance targets.
- Quality Management: lead and drive accuracy in simulations, conduct design of experiments (DoE), plausibility check and sensitivity study of simulations, cross-correlation of simulation results with experimental results, and design optimizations for first time right manufacturability (prototypes and mass production).

Preferred candidate profile

Technical Skills:

- Expertise with simulation tools for high-speed electrical and thermal analysis - Ansys SIwave/HFSS, Keysight Pathwave ADS, Keysight SIPro, Siemens HyperLyx, Cadence Sigrity, Dassault CST Studio Suite, Ansys EMC Plus, Cadence Microwave Office, and Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS.
- Deep understanding of high-speed digital design principles, signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents.
- Good understanding of PCB design and layout tools such as Cadence Allegro, Altium Designer, or Siemens PADS.
- Solid knowledge of industry standards (IPC, JEDEC, PCIe, USB, Ethernet) and PCB manufacturing processes, including design for manufacturability (DFM).

📌 High Speed PCB Simulation Manager (Karnataka)
🏢 Gi Group
📍 Karnataka