Role & Responsibilities:

This role focuses on thermomechanical analysis for electronics applications, including PCB and IC workflows such as modal analysis, FRF, shock and drop analysis, and solder joint reliability. You will contribute to the development of our client by evaluating and enhancing existing workflows and developing new solutions for electronics reliability applications. The role involves creating technical documentation, tutorials, and supporting marketing content while collaborating closely with senior engineers, R&D; teams, and cross-functional stakeholders. You will contribute to complex engineering projects and help drive innovation in simulation workflows for PCB, 3D IC, and electronics applications.

Preferred Qualifications

- Bachelor’s or Master’s degree in Mechanical, Electrical, or Electronics Engineering.

Experience Requirements :

3–4 years of experience in thermo-mechanical simulation or electronics reliability applications.

Strong proficiency in FEA tools such as Altair SimLab, ANSYS, Abaqus, or similar platforms.

Experience with PCB, 3D IC/package analysis, thermal management, and drop/shock reliability workflows.

Experience with linear and nonlinear static and dynamic analyses.

Familiarity with EDA workflows and PCB/3D IC design principles.





Ability to develop and optimize simulation workflows for electronics applications

Python or TCL scripting experience for workflow automation and customization.

Familiarity with PCB design, semiconductor packaging, and 2.5D/3D IC technologies.

Understanding of electronics cooling, thermomechanical reliability, and drop/shock analysis workflows.

Experience including explicit and implicit simulation workflows, and familiarity with tools such as OptiStruct, Radioss, Hypermesh, HEEDS, and NX CAD modeling is a plus

Basic Requirements:

Experience creating technical documentation, tutorials, or training content.

Strong analytical, problem-solving, and debugging skills.

Self-motivated, proactive, and capable of working independently in a collaborative engineering environment.

Excellent communication and cross-functional collaboration skills.

Solid organizational skills with the ability to manage multiple technical tasks and priorities.

CANDIDATES WHO CAN JOIN WITHIN 15DAYS TO 30 DAYS ONLY APPLY . IMMEDIATE JOINEES ARE PREFERRED.

Pay: ₹300,000.00 - ₹500,000.00 per year

Benefits:

- Health insurance
- Provident Fund

Work Location: In person

📌 Application Engineering - Thermomechanical Analysis (India)
🏢 FEMLOGIC TECHNOLOGIES INDIA
📍 India