Job Description

We are looking for a Package Design Engineer to join our advanced silicon packaging design and simulation team and contribute to the design and delivery of high‑performance 2.5D/3D, chiplet‑based, FCBGA, SiP, wire bond and QFP/QFN packages used in industry‑leading products. The role requires robust technical depth in package layout execution, manufacturability, and cross‑domain co‑design with silicon, SI/PI, thermal, and reliability teams.

Key Responsibilities
Perform package layout design and development for advanced packages including 2.5D/3D IC, FCBGA, SiP, and multi‑chip modules.
Develop and maintain package CAD databases, ensuring accuracy and adherence to design guidelines, Design for Manufacturing (DFM), and Design for Assembly (DFA) requirements to ensure producibility.




Manage end-to-end design cycle, including schematic creation, netlist import, footprint assignment, and generation of manufacturing outputs (Gerbers, drill data, fabrication/assembly drawings).
Create and modify substrate/RDL layouts, bump maps, escape routing, and power/ground structures.
Work closely with SI/PI, thermal, reliability, and DFT teams to support co‑design and optimization and participate in design reviews.
Ensure designs comply with foundry, OSAT, and manufacturing design rules (DRC, LVS).
Support ECO cycles, design updates, and version control throughout the project lifecycle.

📌 Senior Package Design Engineer Bengaluru
🏢 renesas electronics
📍 Bengaluru