Chennai, Tamil Nadu
Job Summary

As a Hardware Engineer within the ATE division, you will bridge the gap between silicon design and high-volume production. You will be responsible for the architecture, design, and validation of complex test interface hardware used to characterize and test next-generation high-power supply ICs (e.g., DC-DC controllers, gate drivers, and GaN/SiC-based solutions) on Teradyne platforms like the UltraFLEX or Eagle Test System.

Key Responsibilities
ATE Interface Design: Architect and design high-complexity Device Interface Boards (DIBs/Load Boards) capable of handling high-power levels (high current/high voltage) while maintaining signal and power integrity.
Analog & Power Supply Design: Develop on-board supporting circuitry, including precision analog signal conditioning, custom power regulation modules, and gate driver circuits required for ATE instrumentation.
Simulation & Analysis: Perform extensive SPICE simulations (LTspice, SIMPLIS/SIMETRIX) to validate circuit behavior and conduct Power Integrity (PI) and Signal Integrity (SI) analysis to ensure robust performance under high-speed switching conditions.
Cross-functional Collaboration: Partner with Silicon Design, Design-for-Test (DFT), and Product Engineering teams to define test concepts and hardware requirements for futuristic power controllers.
Hardware Bring-up & Debug:



Lead the hands-on electrical validation and troubleshooting of new test hardware using high-end lab equipment (oscilloscopes, power analyzers) to resolve thermal or noise issues in high-current paths.
PCB Technology: Oversee high-layer count PCB design, selecting appropriate laminates and stack-ups to meet rigorous thermal and electrical isolation standards for high-power IC testing.
Skill Requirements
Education: University degree in Electrical Engineering, Power Electronics, or a related field.
Experience: 5+ years of experience in Power Electronics Design (e.g., DC-DC, AC-DC converters, or power modules) and Analog Circuit Design .
ATE Expertise: Hands-on experience with Teradyne UltraFLEX or similar ATE platforms is highly preferred.
Design Tools: Proficiency in EDA tools such as Altium Designer , Cadence Allegro , or Mentor Graphics .

Technical Knowledge:
Deep understanding of power semiconductor topologies (Buck, Boost, Flyback) and Wide Bandgap (GaN/SiC) technologies.
Robust background in magnetic design, EMI filter design, and high-current PCB layout techniques.

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