Bangalore, Karnataka
Job Summary
IC Package Design Engineer with 3+ years experienced
Experience with Cadence Advanced Package designer, IC Package Design experience with Cadence APD Layout tool
Valuable understanding of package/substrate design and package assembly rules related to flip chip designs.
Key Responsibilities
Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage
Expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies
Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR, LPDDR, GDDR and HSIO interfaces including PCIe, SERDES.
Good Exposure to Stackup design, DFM, DFA rules and adherence.
Should have expertise in constraint setting in layout tool.