Job Title : Principal Engineer, Physical Design

Job Location : Bangalore, India (This position requires a full time, on-site presence in our Bangalore, India Office).

Role &

Responsibilities :

- SoC/Full-chip integration & P&R; Flow Development.
- Establishes the integration plans for die with optimization for package and board constraints.
- Bump planning, Die file generation, closing loop with package team on signal and power bump placement restrictions.
- Create physical database for the IP or SoC. Collaborate with architects to optimize the placement of IPs for latency as well as die area/aspect-ratio.
- Collaborate with the design teams on clocking and dataflow to deliver the physical block level floorplans for APR.
- Derive specifications and collaterals for the IP blocks to execute the floorplan and automatic place and route (APR) at subsequent hierarchies.
- Coordinate with power delivery team on trade-offs for metal allocation for signal and power.
- Have excellent understanding on, die-per-reticle/good-die-per-wafer maximization, and right technology selection on metal layers usage maximization.
- Performs integration of all dies in a package and completes the relevant checks before tape-out.
- Supervise/lead/mentor junior team members.

Minimum Requirements :

- BE/BTech or ME/MTECH with at least 15 years of experience on high complexity SoC designs. At least one SoC in 7nm or lower.




- Demonstrating knowledge and implementation strategies to create an IO ring in accordance with design specifications.
- Possessing deep knowledge of ESD, latch-up, and other foundry requirements, as well as placement strategies.
- Having hierarchical design implementation knowledge, including partitions/HMs/tiles push down to each core/tile.
- Understanding feed-through planning and implementation.
- PG creation and push-down methodologies.
- Understanding Analog components and their placement requirements according to design specifications.
- Demonstrating RDL knowledge and working with packaging for SoC floorplan design.
- Conducting PV clean-up on floorplan and ensuring self-derivation in all sign-offs, including Physical Verification, ESD, foundry/Analog requirements.
- Working knowledge of PnR implementation, physical verification, and STA.
- SoC RTL to GDSII implementation, with top level clocking strategizing and implementation.
- P&R; flow owner which includes but not limited to scripting, flow deployment for SoC & Blocks.

Expertise that is a plus :

- In-depth knowledge of Physical Verification tools like in ICC2, Synopsys ICV, ICWBEV.
- Knowledge of Package PV checks, IO/Bump PV cleanup, PV rules viz. Antenna, Density, DFM, DFY, DPT at lower technology nodes 7nm or less.
- Led PV activities on SoC designs with expertise in DRC, LVS, DFM, HV checks and cleanup.
- Expertise in running PV checks on Flat/Hierarchical SoC designs with multiple power domains.

📌 Principal Physical Design Engineer - Embedded System (India)
🏢 Mindsharp Consulting India
📍 India