Failure Analysis Engineer | Base location in India and who can travel/work in Taiwan.

- Perform the full range of activities in Failure Analysis for customer-returned failure ICs; - Discuss and fully comprehend the customer failure mode, type and rate from CQE/FAE using the CRA form, and ensure customer failure mode has been verified on the bench by the FAE; - Carry out non-destructive analysis such as external package inspection using optical microscopy, continuity checks using digital multimeters or IV curve tracing, X-ray inspection, CSAM, and others where necessary; - Rework failure units through cleaning and re-balling for WLCSPs; - Perform electrical retest of the failure units on the ATE; - Work with Engineering to understand the parametric or functional failure items from the ATE retest; - Carry out further non-destructive verification of the failure mode if necessary, including bench test using EVBs; - Prepare and submit interim 4D/FAR and 8D/CAR to Sales/FAE as an update of the progress for the FA; - Develop the Destructive FA plan that includes Decapsulation, Delayering, High-power OM and SEM, FIB, Cross-sectioning and other analysis techniques by coordinating such work with 3rd party labs.
- Generate,



communicate and submit final 4D/FAR and 8D/CAR to Sales/FAE in a timely manner; - Work closely with SQE on assembly-related quality issues and PE/DE on design-related failures; - Manage customercomplaints by working closely with CQE/SQE and subcontractors on the required action items; - Submit and present FA updates during weekly TQM review meeting; - Perform any other tasks that are assigned by the Supervisor as and when required;

and

- Be an active TQM member by contributing knowledge and value to the team.

Position Requirements

- 1-5 years of work experience in analog/power IC companies
- Knowledge of Failure Analysis and FA techniques, including EFA, NDA, DFA and Fault Isolation
- Positive Understanding of semiconductor device physics and IC packaging technologies will be favorable
- Basic knowledge of Foundry and OSAT processes, especially WLCSP and FC packaging, is highly desirable
- Good communication, interpersonal and team skills Interested? Send your updated profile to [email protected] Know someone who would be a great fit? Please like, comment, and share this post within your network to help us reach the right talent.

📌 Failure Analysis Engineer (Yelahanka)
🏢 Cyient Semiconductors
📍 Yelahanka