Job DescriptionFailure Analysis Engineer | Base location in India and who can travel/work in Taiwan. NJob Description: Nn Perform the full range of activities in Failure Analysis for customer-returned failure ICs; n Discuss and fully comprehend the customer failure mode, type and rate from CQE/FAE using the CRA form, and ensure customer failure mode has been verified on the bench by the FAE; n Carry out non-destructive analysis such as external package inspection using optical microscopy, continuity checks using digital multimeters or IV curve tracing, X-ray inspection, CSAM, and others where necessary; n Rework failure units through cleaning and re-balling for WLCSPs; n Perform electrical retest of the failure units on the ATE; n Work with Engineering to understand the parametric or functional failure items from the ATE retest; n Carry out further non-destructive verification of the failure mode if necessary, including bench test using EVBs; n Prepare and submit interim 4D/FAR and 8D/CAR to Sales/FAE as an update of the progress for the FA; n Develop the Destructive FA plan that includes Decapsulation, Delayering, High-power OM and SEM, FIB, Cross-sectioning and other analysis techniques by coordinating such work with 3rd party labs. N Generate,



communicate and submit final 4D/FAR and 8D/CAR to Sales/FAE in a timely manner; n Work closelywith SQE on assembly-related quality issues and PE/DE on design-related failures; n Manage customer complaints by working closely with CQE/SQE and subcontractors on the required action items; n Submit and present FA updates during weekly TQM review meeting; n Perform any other tasks that are assigned by the Supervisor as and when required; andn Be an active TQM member by contributing knowledge and value to the team. NnPosition Requirements: Nn 1-5 years of workexperience in analog/power IC companies N Knowledge of Failure Analysis and FA techniques, including EFA, NDA, DFA and Fault Isolation N Valuable Understanding of semiconductor device physics and IC packaging technologies will be favorable N Basic knowledge of Foundry and OSAT processes, especially WLCSP and FC packaging, is highly desirable N Good communication, interpersonal and team skills NnInterested? Send your updated profile to [email protected] NKnow someone who would bea great fit? Please like, comment, and share this post within your network to help us reach the right talent.

📌 Failure Analysis Engineer (Vasanthanagar)
🏢 Cyient Semiconductors
📍 Vasanthanagar