Experience in design for manufacturing DFM including plastic injection molding metal casting machining stamping and forming Experience in electronic board design Experience in leading full life cycle projects Experience with PLM systems engineering changes BOM structuring etc Experience in design of indoor and outdoor equipment Experience in thermal dynamical and statical design and analysis Experience in design of telecommunication RF equipment - an advantage Experience in mentoring engineers - an advantage Perform analysis testing design iterations and validation of the designs Requirements Qualification BE in Mechanical Engineering from an accredited university ME an advantage At least 5 years of experience in electronics packaging design Strong understanding of GD T drawings assembly tolerances Proficiency in SolidWorks Proficiency in writing as well as speaking in English Must be self-motivated able to work under pressure and multitask Team player with robust technical and communication skills