We have a requirement for thermal simulation and find the JD below
- Thermal Simulation for the characterization and development of power modules Flip chip BGA wire bond on package, board, and system level
- Generation of simulation and compact models for end customers.
- Thermal virtual prototyping and simulation-based product optimization.
- Thermal consulting of internal customers from development and application; close interaction with customers from a problem statement to simulation results interpretation and delivery.
- Working in close exchange with the multi-cultural team.
A degree in Mechanical / Electronics Engineering, Physics, or a similar field
At least 3-5 years of skilled experience in thermal FEM/ CFD simulations
Very good hands-on experience with Ansys workbench, Icepak, AEDT
Knowledge in creating and modifying 3D CAD geometries for simulation.