This is a hands-on, individual-contributor role for a PCB design specialist who takes pride in craftsmanship and enjoys turning complex architecture into elegant, manufacturable boards. You will focus on what you do best — physical design and layout execution — bringing challenging high-speed, high-density designs to life across Industrial, Railway, AGV, and Edge AI platforms. You will partner closely with experienced Hardware Design, System Architecture, and SI/PI teams who set the product direction and constraints, freeing you to concentrate on layout excellence, design closure, and manufacturing readiness.

It is a role built for deep technical mastery, with a transparent specialist growth path that keeps your time on the board and your craft at the center.

Roles and Responsibilities

PCB Layout: complex 10+ layer layouts, placement strategy, constraint-driven & high-speed routing, DDR routing, differential pair length/timing matching, controlled impedance, return-path optimization, multi-board interconnect & rugged connectors.

- High-Speed Interfaces: hands-on layout of PCIe Gen3/4/5, USB 3.2 Gen2, HDMI 2.0, SGMII, RGMII, 1GbE, 10GbE, SFP/SFP+, LPDDR4/5, NVMe.
- Power: power distribution & rail routing, decoupling &
- VRM layout, high-current routing, PI-conscious practices, grounding strategy.
- EMI/EMC: return-current management, isolation & shielding, noise mitigation, compliance-oriented routing.
- Manufacturing: DFM/DFA, panelization & fabrication review, assembly documentation, Gerber/ODB++ package generation, PCB vendor interaction.
- Mechanical: mechanical-constraint & connector positioning, rugged-enclosure & thermal placement, heat-sink interface, tolerance management.
- Validation: board bring-up & hardware debug, layout-failure investigation, root-cause & production-issue resolution. 3.

Skills Core PCB &

• High-Speed Skills • 10+ layer &
- HDI design (blind/buried vias, microvias, backdrilling), controlled-impedance & high-density layout.
- SI &
- PI fundamentals, PDN awareness, crosstalk mitigation,



return-path management, via optimization, reference-plane strategy.
- Industrial product experience: ruggedized/railway electronics, industrial networking, edge-computing platforms, gateways, managed switches.
- Layout exposure to high-performance SOMs, PCIe systems, PCIe-to-Ethernet bridges, 1/10GbE, SFP/SFP+, cellular/GNSS, TPM 2.0, NVMe, LPDDR4/5, USB 3.2/HDMI 2.0, PoE/PoE+, rugged mezzanine, wide-input power.

Applied

Domain &

• Advanced Skills • Edge AI carrier boards: laying out SOM-based edge-AI carrier boards — PCIe Gen3/Gen4 to NVMe and PCIe-to-Ethernet bridges, USB 3.2 Gen2, HDMI 2.0, and high-density SODIMM/board-to-board (e.g., 260-pin) SOM connector fan-out.
- Managed switch fabrics: routing multi-port 1GbE/10GbE and SGMII/RGMII/QSGMII around managed switch silicon with SFP/SFP+ cages, magnetics placement, and PoE/PoE+ power sourcing paths.
- Wireless & positioning integration: RF-aware layout for cellular LTE/5G modems (M.2 form factor) and GNSS/GPS modules — 50 controlled-impedance RF traces, antenna/coax launch, keep-outs, and isolation from digital/switching noise.
- Secure & storage subsystems: TPM 2.0 device placement/routing and NVMe M.2 storage integration, including SI-clean routing under mechanical and shielding constraints.
- Rugged / rail compliance: designing to EN 50155 (rail), IEC 62443-conscious layout partitioning, industrial -40 C to +85 C operation, and shock/vibration ruggedization for AGV and rail enclosures.
- SI/PI &
- DFM close-loop: interpreting SI/PI-team simulation feedback (impedance, crosstalk, PDN targets) into layout edits, co defining stack-ups with fab partners, EMC pre-compliance rework, and IPC-7351 footprint/library creation for NPI release to CMs.

4–6 years dedicated PCB layout, with proven high-speed multilayer (10+ layer, HDI) delivery in industrial or networking products. • Hands-on constraint-driven, controlled-impedance designs (differential-pair & DDR); DFM/DFA-to-release with vendor interaction; board bring-up & debug participation. • Bachelors in Electronics/Electrical Engineering or equivalent hands-on experience.

📌 Senior PCB Design Engineer – High-Speed & Rugged Embedded Systems (Bengaluru)
🏢 Utthunga Technologies
📍 Bengaluru