Role

- Define and own process integration strategy for next-generation SiC and GaN power semiconductor technologies from technology development through high-volume manufacturing.
- Architect and optimize complete semiconductor process flows in collaboration with external foundries and technology partners.
- Lead process integration across epitaxy, implantation, oxidation, annealing, lithography, dielectric formation, etching, metallization, passivation, and backend process modules.
- Define and execute comprehensive DOE strategies to establish robust process windows and improve manufacturability.
- Establish process control methodologies, monitor critical process parameters, and improve process capability using statistical process control (SPC) techniques.
- Correlate inline process data, electrical characterization, reliability results, and physical failure analysis to optimize process performance and manufacturing yield.
- Lead yield improvement initiatives through defect reduction, process optimization, and systematic root-cause analysis.
- Define process qualification strategy and ensure compliance with JEDEC, AEC-Q101, and customer-specific reliability requirements.
- Lead technology transfer from development into high-volume manufacturing.
- Provide technical leadership during foundry engagements, process audits, technology reviews, and manufacturing readiness assessments.
- Develop long-term process technology roadmaps and evaluate emerging semiconductor process technologies.




- Mentor engineers and provide technical leadership across cross-functional technology development programs.

Requirements
- MS/PhD in Electrical Engineering, Materials Science, Semiconductor Physics, or a related discipline.
- 10+ years of experience in semiconductor process integration, technology development, or manufacturing engineering for power semiconductor devices.
- Extensive experience with SiC, GaN, or advanced silicon power semiconductor technologies.
- Deep understanding of semiconductor fabrication processes including epitaxy, ion implantation, oxidation, annealing, lithography, dielectric deposition, etching, metallization, passivation, and wafer processing.
- Proven expertise in process integration, DOE, yield improvement, SPC, process capability analysis, and manufacturing process control.
- Demonstrated experience working with external wafer foundries and technology partners in a fabless or hybrid manufacturing workplace.
- In-hand process development experience in a foundry environment is desirable.
- Strong knowledge of semiconductor defect mechanisms, crystal defects, process variability, and reliability physics.
- Experience correlating electrical characterization, inline metrology, and physical failure analysis for process optimization.
- Thorough understanding of JEDEC, AEC-Q101, PPAP, and automotive quality requirements.
- Demonstrated technical leadership, successful technology commercialization, and cross-functional project leadership.
- Excellent communication, mentoring, and stakeholder management skills.

📌 Principal Process Integration Engineer (Bengaluru)
🏢 Lu0026T Semiconductor Technologies
📍 Bengaluru