Job Description
This position is a packaging front-end R&D; intern, and will be focusing on IC (integrated circuit) packaging technology research and development, work with global team to finish development projects and other tasks as listed below:
Duties and Responsibilities
• New packaging technology development
• Current package related process development
• Advanced material interface study
• Advanced IC package failure analysis
• Coordinate/lead development project independently
• Communication/cooperation among global teams (US/ Europe /Malaysia/Japan/France/etc.)
Qualification
Pursuing in bachelor or master degree. Major on: Metallic Materials Engineering; Polymer Materials Engineering; Mechanical Engineering and Automation. Good communication of oral and written English.
More information about NXP in Greater China... #LI-65f0