Wire Bond Process Manager (Mumbai)

Wire Bond Process Manager (Mumbai)

05 Aug
|
NXP Semiconductors
|
Mumbai

05 Aug

NXP Semiconductors

Mumbai

Wire Bond Process Manager

Experience: Not Available to Not Available years

Location: Kaohsiung

Skills: AFE manufacturing, process capability, technology training, operation training, Q/C/D-related improvement, corrective actions, cycle time improvement, cost reduction

Company Overview
More information about NXP in Greater China... #LI-9599

Duties and Responsibilities
Identify and set a consolidated implementation plan for gearing up new process, new material, new equipment to get best operation for mass production. Improve the AFE process capability and stability to achieve the best quality and yield performance in the AFE manufacturing line. Provide technology and operation training to instructors, technicians, and machine keepers in AFE processes of manufacturing lines to support smooth production.



Cooperate with Innovation / IMD / vendors / manufacturing lines to develop new packages and current processes, ensuring smooth production ramp-up and meeting budgeted yield requirements. Implement and control the progress of Q/C/D‑related improvement projects. Implement corrective actions for low yield and customer complaint issues related to Q/C/D, based on analysis with the Q&R; department. Train, coach, and motivate subordinates through various activities to support individual growth and enhance technical capability. Refine AFE process flow to improve cycle time and cost.

📌 Wire Bond Process Manager (Mumbai)
🏢 NXP Semiconductors
📍 Mumbai

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