05 Aug
|
NXP Semiconductors
|
Mumbai
05 Aug
NXP Semiconductors
Mumbai
HV/BCD Principal Engineer
Experience: Not Available to Not Available years
Location: Hsinchu
Skills: Device Architecture, Device Physics, 180nm BCD process nodes, TCAD, Sentaurus, Silvaco, JMP, Cadence, Layout, Virtuoso, GaN, SiC, IGBT, Silicon Photonics, Process Integration, Product Engineering
Role Purpose
Lead the development and optimization of high-voltage (HV) and BCD device architectures. This role requires a deep understanding of device physics and a data-driven approach to ensure industry-leading performance and reliability for power management solutions.
Key Responsibilities
- Device Development: Lead the architecture design and optimization of HV devices (LDMOS, EDMOS, ESD) on 180nm to 55nm BCD nodes.
- Physics Analysis: Analyze and optimize Device Physics parameters, including BV, Rdson , SOA, and reliability (HCI/NBTI).
- Simulation & Modeling: Utilize TCAD for 2D/3D process and device simulations to accelerate development cycles.
- Device Verification: Define verification plans and execute statistical analysis using JMP for DOE and WAT data.
- Design Integration: Work within Cadence environments for layout review and test structure design.
- Cross-functional Collaboration: Partner with PI and PE teams to resolve yield, reliability, and manufacturing bottlenecks.
Required Qualifications
- Experience: Master’s or Ph.D. in EE, Physics, or related field with 10+ years of semiconductor industry experience.
- Technical Expertise:
1. Profound knowledge of Device Architecture and Device Physics.
2. Hands-on experience in 180nm to 55nm BCD process nodes.
- Tools:
1. Expertise in TCAD (Sentaurus / Silvaco ).
2. Expertise in JMP for statistical data analysis.
3. Proficiency in Cadence (Layout/Virtuoso).
Preferred Qualifications (Plus)
- Advanced Power Devices: Experience with GaN , SiC , or IGBT development.
- Silicon Photonics: Knowledge of Photonics integration and device physics.
- Domain Knowledge:
1. Process Integration (PI): Understanding of mask flow and doping profiles.
2. Product Engineering (PE): Experience in CP/FT data correlation and yield enhancement.
Competencies
- Accountability: Robust ownership of project milestones and outcomes.
- Critical Thinking: Ability to identify root causes in complex device failures.
- Interpersonal Skills: Effective communication across design and foundry teams.
- Data-driven: Committed to objective decision-making through rigorous data analysis.
More information about NXP in Greater China... #LI-9599
📌 HV/BCD Principal Engineer (Mumbai)
🏢 NXP Semiconductors
📍 Mumbai