Failure Analysis Engineer

Experience: Not Available to Not Available years

Location: Kuala Lumpur

Skills: SEM/EDX, OBIRCH, emission microscopy, electrical fault isolation debug tools, failure analysis methodologies, semiconductor device physics, processing technologies, packaging technologies, curve tracing, logic analysis, oscilloscopes, statistical analysis tools

Job Summary
As a Failure Analysis Engineer at NXP Semiconductors, you will play a crucial role in ensuring the quality and reliability of our cutting-edge semiconductor products. You will be responsible for investigating and identifying the root causes of device failures, contributing directly to product improvement and customer satisfaction.

Job Responsibilities
• Perform detailed electrical failure analysis on advanced semiconductor devices, including microcontrollers, processors, and analog circuits.
• Utilize a wide range of analytical techniques and equipment, such as SEM/EDX, OBIRCH, emission microscopy, and various electrical fault isolation debug tools.
• Develop and implement new failure analysis methodologies and techniques to address emerging technologies and failure modes.
• Collaborate closely with design, product, test, and reliability engineering teams to provide timely and accurate failure analysis reports and corrective actions.
• Document analysis results thoroughly, including detailed observations, conclusions, and recommended solutions.




• Participate in cross-functional teams to drive continuous improvement in product quality, manufacturing processes, and design.
• Provide technical expertise and mentorship to junior engineers and technicians.
• Stay up-to-date with the latest advancements in failure analysis technologies and semiconductor device physics.

Job Qualifications
• Bachelor, Master's or Ph.D. in Electrical Engineering, Materials Science, Physics, or a related field.
• Proven experience (3+ years) in semiconductor failure analysis within a high-volume manufacturing or R&D; workplace.
• Strong theoretical and practical knowledge of semiconductor device physics, processing, and packaging technologies.
• Hands-on experience with a broad range of failure analysis tools and techniques (SEM/EDX, PEM, LIT, OBIRCH, LVP/EOP, etc.).
• Proficiency in electrical debug and characterization techniques, including curve tracing, logic analysis, and oscilloscopes.
• Excellent problem-solving skills and a methodical approach to root cause analysis.
• Strong communication skills, both written and verbal, with the ability to present complex technical information clearly and concisely.
• Ability to work effectively in a collaborative, fast-paced environment.
• Experience with statistical analysis tools and methodologies is a plus.
More information about NXP in Malaysia... #LI-633a

📌 Failure Analysis Engineer (Mumbai)
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