Principal Process Integration Engineer

Experience: Not Available to Not Available years

Location: Hsinchu

Skills: CMOS, Non-Volatile Memory, NVM, eFlash, RRAM, MRAM, data analysis tools, JMP, Python, Spotfire, BCD, Bipolar-CMOS-DMOS, PMIC, NVM integration

Why This Role?
Drive Core Technology: Lead the integration and development of advanced CMOS processes and Non-Volatile Memory (NVM), directly impacting product performance and market competitiveness. Lead Mass Production Breakthroughs: Take ownership of the critical path from Current Product Introduction (NPI) to high-volume manufacturing, defining technical specifications and Best Known Methods (BKM). Cross-Domain Collaboration: Bridge the gap between design teams and Tier-1 Foundries, exerting technical influence at advanced process nodes (28nm and below).

Key Responsibilities
Process Integration Leadership: Lead the design of CMOS and NVM process flows; optimize device performance to achieve industry-leading yield and reliability benchmarks. Deep Characterization & Analysis: Conduct statistical and Physical Failure Analysis (PFA) for fail modes; proactively identify process defects and drive optimization solutions. Yield Enhancement & Stability: Spearhead cross-functional yield improvement programs to ensure production stability and cost-efficiency. Foundry Management: Lead technical teams in collaboration with international major foundries, managing technical alignment, communication, and process transfer.

Required Qualifications
Education:



Master’s degree or PhD in Electronics, Electrical Engineering, Physics, Materials Science, or a related field. Experience: 10+ years of semiconductor industry experience, with a focus on CMOS logic processes or NVM technologies (eFlash, RRAM, MRAM). Data Insight: Proficiency in data analysis tools (e.g., JMP, Python, or Spotfire) with a proven ability to analyze complex statistical distributions and electrical characteristics.

Preferred Skills
Process Transfer Expertise: Successful track record in "Copy-Smart" process migration, ensuring process consistency and rapid yield ramp-up during technology transfer. BCD Process Expertise: Experience in BCD (Bipolar-CMOS-DMOS) process development or integration; familiarity with PMIC (Power Management IC) optimization. Advanced Node Experience: Proven experience in NVM integration and mass production at 28nm/16nm/12nm or beyond. Design Collaboration: Solid understanding of memory architecture, NVM operation principles, and peripheral circuit design.

Soft Qualities
Analytical Thinking: Ability to synthesize complex data into actionable insights and identify root causes of technical anomalies. Proactive Ownership: Courage to transcend functional boundaries and mobilize resources to overcome technical bottlenecks. Effective Communication: Excellence in translating complex engineering issues into clear, actionable optimization strategies for design and process teams. More information about NXP in Greater China... #LI-7743

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