Senior Technical Lead - Low power rf, EMI/EMC Design, HVAC System

Experience: Not Available to Not Available years

Location: Bengaluru, India

Skills: Cadence Advanced Package designer, IC Package Design, Cadence APD Layout tool, package/substrate design, package assembly rules, flip chip designs, MCM, flip chip, wire bond, 3D, 2.5D, High-Speed Complex Package, PCB designs, HDI, Blind Via, Buried Via, High Speed Parallel Bus interfaces, DDR, LPDDR, GDDR, HSIO interfaces, PCIe, SERDES, Stackup design, DFM, DFA, constraint setting, low power rf technologies, emi/emc design techniques, mitigation strategies, HVAC systems, leadership, problem-solving, relevant certifications in low power rf, EMI/EMC Design, HVAC Systems

Job Summary
• Experience with Cadence Advanced Package designer, IC Package Design experience with Cadence APD Layout tool
• Good understanding of package/substrate design and package assembly rules related to flip chip designs.
• Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage
• Expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies
• Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR, LPDDR, GDDR and HSIO interfaces including PCIe, SERDES.
• Good Exposure to Stackup design, DFM, DFA rules and adherence.
• Should have expertise in constraint setting in layout tool.

Key Responsibilities
1.



Lead and manage projects focusing on low power rf, emi/emc design, and hvac systems, ensuring adherence to quality standards and timelines.
2. Provide technical guidance and mentorship to team members, assisting in problem-solving and decision-making processes.
3. Collaborate with cross functional teams to design and implement innovative solutions in the areas of low power rf, emi/emc design, and hvac systems.
4. Conduct testing, analysis, and troubleshooting of systems to identify and resolve technical issues.
5. Stay updated on industry trends, technologies, and best practices related to low power rf, emi/emc design, and hvac systems.
6. Ensure compliance with regulatory standards, safety protocols, and quality assurance processes.

Skill Requirements
1. Robust understanding and experience in low power rf technologies, including design principles and implementation.
2. Proficiency in emi/emc design techniques, mitigation strategies, and compliance requirements.
3. Knowledge of hvac systems, including design, installation, maintenance, and troubleshooting.
4. Excellent leadership and communication skills to effectively lead a team and collaborate with stakeholders.
5. Problem-solving abilities to identify and address technical challenges in the domains of low power rf, emi/emc design, and hvac systems.

Other Requirements
1. Relevant certifications in low power rf, EMI/EMC Design, or HVAC Systems are a plus.

📌 Senior Technical Lead Low power rf, EMI/EMC Design, HVAC System (Bengaluru)
🏢 HCL Technologies
📍 Bengaluru