Wire Bond Process Assistant Engineer (India)

Wire Bond Process Assistant Engineer (India)

06 Aug
|
Freescale Semiconductor
|
India

06 Aug

Freescale Semiconductor

India

Wire Bond Process Assistant Engineer

Experience: Not Available to Not Available years

Location: Kaohsiung

Skills: 統計分析, 報表製作, 資料整理, 產品追蹤, 實驗設計 (DOE), 製程改善, 製程文件維護, SOP更新

Duties and Responsibilities

製程數據、實驗結果與量測資料之彙整、輸入及文書管理。 協助進行基本統計分析(如平均值、趨勢圖、良率統計等),並製作簡易報表。 協助異常產品之初步處理與分析,包含資料整理、產品追蹤。 支援製程工程師進行實驗(DOE)或製程改善相關之資料準備工作。 協助維護製程文件、SOP 及相關記錄之更新。 其他主管交辦之製程支援事項。

📌 Wire Bond Process Assistant Engineer (India)
🏢 Freescale Semiconductor
📍 India

Reply to this offer

Impress this employer describing Your skills and abilities, fill out the form below and leave Your personal touch in the presentation letter.

Subscribe to this job alert:

Get the latest job offers by email for: wire bond process assistant engineer (india) / india

Subscribe to this job alert:

Get the latest job offers by email for: wire bond process assistant engineer (india) / india