Experienced preferably in Designing single-side, Double side, and Multilayer PCB (Up to 6 layers) For Process Control Instruments In the Safety And IOT Range Of Products.
- Footprint and Symbol Creation as per the IPC design standards.
- Design of High Speed, Impedance PCB layouts.
- Solid experience in Placement & Routing.
- PCB Designing of multilayers.
- Layout Experience on high-speed interfaces
- Designing of PCB under EMC/EMI complaints, crosstalk, and signal integrity.
- Basic knowledge of Circuit designing, PCB Layer stack-up, PCB Fabrication, and PCB Assembly
Skills :
1. PCB Design: Design single-side, double-side, and multilayer PCBs (up to 6 layers) specifically for Process Control Instruments, including Safety and IoT product ranges.
2. Footprint and Symbol Creation: Develop footprints and symbols in compliance with IPC design standards.
3. High-Speed PCB Layouts: Design high-speed,
impedance-controlled PCB layouts, ensuring signal integrity and optimal performance.
4. Component Placement and Routing: Apply expertise in precise component placement and efficient routing for multilayer PCB designs.
5. High-Speed Interfaces: Work on PCB layouts for high-speed interfaces, ensuring reliability and accuracy.
6. EMC/EMI Compliance: Design PCBs in adherence to electromagnetic compatibility (EMC) and electromagnetic interference (EMI) compliance standards.
7. Circuit Design Knowledge: Possess a basic understanding of circuit design, PCB layer stack-ups, fabrication processes, and assembly techniques.
8. Quality Assurance: Collaborate with cross-functional teams to ensure that designs meet performance, manufacturing, and reliability requirements.