We are looking for a hands-on Packaging Engineer to support SSD package development from concept through qualification and high-volume manufacturing. This role will work closely with global design, reliability, process, operations, OSAT, and supplier teams to deliver innovative, manufacturable, and reliable packaging solutions.

- Support SSD package development from concept, design validation, qualification, and high-volume manufacturing ramp.
- Review package design drawings and provide feasibility feedback, DFX input, and improvement recommendations.
- Collaborate with global engineering, reliability, process, operations, OSAT, and supplier teams to ensure design implementation and manufacturing readiness.
- Support engineering builds, characterization, package qualification plans, and risk mitigation activities.
- Monitor assembly and test yield, support failure analysis, and drive corrective and preventive actions.
- Contribute to assembly process flows, work instructions, FMEA/PFMEA, control plans, process recipes, and SPC monitoring.
- Support the introduction of current packaging technologies, materials, and processes into production. Qualifications

Required Qualifications





- Master s degree or higher in Materials Science, Manufacturing, Mechanical Engineering, Packaging Engineering, or related engineering disciplines.
- 3 5 years of relevant experience with a master s degree, or 0 3 years with a PhD.
- Strong understanding of SMT, PCBA, PCB layout, solder joint reliability, board-level reliability, packaging materials, and failure analysis.
- Experience with DOE, statistical analysis, structured problem solving, and tools such as Minitab, JMP, or equivalent.
- Ability to work effectively in a fast-paced, cross-functional, global environment with strong communication and execution skills.

Preferred Qualifications

- Excellent written and communication skills, enabling collaboration with global functional teams
- Knowledge of thermo-mechanical aspects of semiconductor packages
- Knowledge in data analytics or AI/ML techniques is a plus. This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying

📌 Senior Packaging Engineer (Bengaluru)
🏢 Western Digital
📍 Bengaluru