- Expertise in physical verification (LVS, ERC/PERC, DFM, OPC, Tape Out process) of SoC/Full-chip-level and/or block-level
- Preferably worked on 5nm/7nm/12nm/14nm/16nm/22nm nodes at the major foundries
- Experience in developing sign-off methodology/flow to and supporting a larger team
- Experience in debugging LVS issues at chip-level with complex analog-mixed signal Ips
- Experience with design using low-power implementation (level-shifters, isolation cells, power domain/islands, substrate isolation etc.)
- Experience in physical verification of I/O Ring, corner cells, seal ring, RDL routing, bumps and other full-chip components
- Expert in EDA Tools: Mentor (Calibre), Synopsys (ICV)
- Experience with ERC rules, PERC rules, ESD rules has an added advantage
- Robust communication skills, problem solving and analytical skills
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