Experienced preferably in Designing single-side, Double side, and Multilayer PCB (Up to 6 layers) For Process Control Instruments In the Safety And IOT Range Of Products.
Footprint and Symbol Creation as per the IPC design standards.
Design of High Speed, Impedance PCB layouts.
Solid experience in Placement & Routing.
PCB Designing of multilayers.
Layout Experience on high-speed interfaces
Designing of PCB under EMC/EMI complaints, crosstalk, and signal integrity.
Basic knowledge of Circuit designing, PCB Layer stack-up, PCB Fabrication, and PCB Assembly
Skills :
PCB Design: Design single-side, double-side, and multilayer PCBs (up to 6 layers) specifically for Process Control Instruments, including Safety and IoT product ranges.
Footprint and Symbol Creation: Develop footprints and symbols in compliance with IPC design standards.
High-Speed PCB Layouts: Design high-speed,
impedance-controlled PCB layouts, ensuring signal integrity and optimal performance.
Component Placement and Routing: Apply expertise in exact component placement and productive routing for multilayer PCB designs.
High-Speed Interfaces: Work on PCB layouts for high-speed interfaces, ensuring reliability and accuracy.
EMC/EMI Compliance: Design PCBs in adherence to electromagnetic compatibility (EMC) and electromagnetic interference (EMI) compliance standards.
Circuit Design Knowledge: Possess a basic understanding of circuit design, PCB layer stack-ups, fabrication processes, and assembly techniques.
Quality Assurance: Collaborate with cross-functional teams to ensure that designs meet performance, manufacturing, and reliability requirements.