As a Staff Product Development Engineer in the Signal Integrity Center of Excellence SI COE you will lead advanced signal integrity SI research modeling and validation for next-generation high-speed interconnects used in AI data centers and high-performance computing HPC Your role involves independently conducting SI studies and design platforming including geometry analysis and simulation-driven optimizations You will be responsible for exploring new SI methodologies conducting literature reviews formulating research plans programming simulating and testing to develop innovative solutions even in ambiguous environments You will collaborate closely with mechanical manufacturing materials and operations teams to drive the adoption of cutting-edge SI technologies As a subject matter expert you will oversee the entire SI lifecycle from initial analysis and modeling to design simulation prototype fabrication and final validation You will tackle complex design challenges leveraging advanced simulation tools to optimize designs for manufacturability and performance Job Responsibilities Drive SI design simulation and validation for next-gen high-speed interconnects 112G 224G PAM4 PCIe Gen6 7 Co-Packaged and Near Package through the product development cycle Conducting SI COE analysis including Performing signal integrity simulations and analysis for high-speed interconnect product development This includes determining the correct simulation methodology and setup to use as well as a good understanding of the criteria for each interface Modeling the connector with the consideration of manufacture impact and application impact Providing solutions to the SI challenges This includes identifying the problems making research plans developing current technologies and training and sharing the findings with the SI community Develop novel interconnect solutions by optimizing mating interfaces lead frames and PCB transitions for resonance-free low-loss performance Enhance bulk cable design termination techniques to minimize skew impedance mismatches and signal degradation Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures Utilize AI big data analytics for predictive SI modeling auto-routing and performance optimization Optimize material selection electromagnetic design to improve noise isolation signal integrity and high-frequency response Collaborate with NPD teams industry partners to influence SI strategies technology roadmaps and next-gen product designs Represent TE at industry forums IEEE OIF PCI-SIG etc and contribute to next-gen SI standards What your background should look like Generally requires Bachelors degree in appropriate field with a minimum of 8 years of experience Masters degree or higher or local equivalent may be preferred at this level Competencies Values Integrity Accountability Inclusion Innovation Teamwork Job Locations Bangalore Karn taka 560066 India Travel Required 10 to 25 Requisition ID 139248 Workplace Type External Careers Page Engineering Technology

📌 Lead - Signal Integrity (Karnataka)
🏢 TE Connectivity
📍 Karnataka