Manager - PCB Design

Location: Bangalore

Experience: 10–15 Years

Join a global engineering team and lead the design and development of high-speed, multi-layer PCBs for next-generation connectivity solutions.

Key Responsibilities :

Drive end-to-end PCB design, layout, reviews, and design governance.

Design high-speed, HDI, RF, and multi-layer PCBs with a focus on SI/PI, EMI/EMC, and DFM/DFA.

Collaborate with Hardware, Mechanical, SI, Manufacturing, and Global Engineering teams to deliver high-quality products.

Support NPI, ECAD library management, process improvements, and engineering best practices.

Required Skills :

Solid experience in High-Speed PCB Design and Multi-layer PCB Layout.

Expertise in Signal Integrity (SI), Power Integrity (PI), PCB Stack-up, Controlled Impedance, and High-Speed Interfaces (DDR, PCIe, USB, Ethernet, SerDes).

Hands-on experience with Cadence Allegro, Altium Designer, Mentor Xpedition/PADS, or OrCAD.

Excellent stakeholder management and cross-functional collaboration skills.

📌 Printed Circuit Board Design Engineer (Bengaluru)
🏢 Domnic Lewis
📍 Bengaluru