Responsibilities: Production Management

Oversee Front-of-Line (FOL) operations, including back grinding, wafer mounting, dicing, die sorting, Die bonding / flip attach and wire bonding.

Develop and implement production schedules to meet customer demands and delivery timelines.

Ensure effective utilization of equipment and workforce to achieve maximum productivity.

Process Optimization & Continuous Improvement:

Monitor and analyze key performance indicators (KPIs) such as yield, cycle time, and throughput.

Drive continuous improvement initiatives using Lean Manufacturing and Six Sigma methodologies.

Collaborate with process engineers to identify bottlenecks and improve FOL processes.

Quality & Compliance:

Ensure FOL operations meet quality standards (ISO, IATF 16949, JEDEC, etc.) and customer requirements.

Work with the Quality Assurance team to address defects, yield losses, and process deviations.

Maintain compliance with ESD (Electrostatic Discharge), contamination control, and cleanroom protocols.

Equipment & Technology Management:

Oversee the maintenance and calibration of FOL equipment (BG,dicing saws, die/wire bonders, wafer handling tools).

Evaluate and implement new automation and technology solutions to enhance productivity.

Coordinate with vendors for equipment upgrades and troubleshooting.

Team Leadership & Training:

Manage and develop a team of FOL technicians, operators, and engineers.

Provide training and skill development to ensure high workforce competency.

Foster a culture of safety, teamwork, and operational excellence.

Cost Management & Reporting:

Optimize operational costs by reducing material waste, improving efficiency, and controlling downtime.

Prepare and present weekly/monthly reports on FOL performance, challenges, and improvement plans.





Work closely with supply chain and procurement teams to ensure the availability of raw materials and tools.

Qualification Requirements: Bachelor’s degree /Diploma holder in Engineering (Electronics, Mechanical, Industrial, or related field).

10+ years of experience in semiconductor OSAT or IC packaging industry, with at least 2 years in a managerial role.

Strong knowledge of FOL processes, semiconductor manufacturing, and packaging technologies.

Experience in advanced packaging (Flip Chip, WLP, QFN… etc).

Experience with Lean Manufacturing, Six Sigma, and process automation.

Proficiency in manufacturing software (MES, SPC, ERP, etc.). Strong leadership, communication, and problem-solving skills.

Job Category: Engineering Job Type: Full Time Job Location: Hyderabad Responsibilities: Production Management:

Oversee Front-of-Line (FOL) operations, including back grinding, wafer mounting, dicing, die sorting, Die bonding / flip attach and wire bonding.

Develop and implement production schedules to meet customer demands and delivery timelines.

Ensure efficient utilization of equipment and workforce to achieve maximum productivity.

Process Optimization & Continuous Improvement:

Monitor and analyze key performance indicators (KPIs) such as yield, cycle time, and throughput.

Drive continuous improvement initiatives using Lean Manufacturing and Six Sigma methodologies.

Collaborate with process engineers to identify bottlenecks and improve FOL processes.

Quality & Compliance:





Ensure FOL operations meet quality standards (ISO, IATF 16949, JEDEC, etc.) and customer requirements.

Work with the Quality Assurance team to address defects, yield losses, and process deviations.

Maintain compliance with ESD (Electrostatic Discharge), contamination control, and cleanroom protocols.

Equipment & Technology Management:

Oversee the maintenance and calibration of FOL equipment (BG,dicing saws, die/wire bonders, wafer handling tools).

Evaluate and implement new automation and technology solutions to enhance productivity.

Coordinate with vendors for equipment upgrades and troubleshooting.

Team Leadership & Training:

Manage and develop a team of FOL technicians, operators, and engineers.

Provide training and skill development to ensure high workforce competency.

Foster a culture of safety, teamwork, and operational excellence.

Cost Management & Reporting:

Optimize operational costs by reducing material waste, improving efficiency, and controlling downtime.

Prepare and present weekly/monthly reports on FOL performance, challenges, and improvement plans.

Work closely with supply chain and procurement teams to ensure the availability of raw materials and tools.

Qualification Requirements: Bachelor’s degree /Diploma holder in Engineering (Electronics, Mechanical, Industrial, or related field).

10+ years of experience in semiconductor OSAT or IC packaging industry, with at least 2 years in a managerial role.

Strong knowledge of FOL processes, semiconductor manufacturing, and packaging technologies.

Experience in advanced packaging (Flip Chip, WLP, QFN… etc).

Experience with Lean Manufacturing, Six Sigma, and process automation.

Proficiency in manufacturing software (MES, SPC, ERP, etc.). Strong leadership, communication, and problem-solving skills.

📌 Front-of-Line (FOL) Manager (Hyderabad)
🏢 ASIP Technologies
📍 Hyderabad