Role Overview

We are looking for a seasoned semiconductor expert to drive deployment and evolution of next-generation 3DIC design and signoff solutions for advanced packaging, chiplet-based architectures, HBM, and heterogeneous integration.

This role requires close collaboration with R&D;, Product Engineering, and strategic customers to solve complex design challenges, influence product direction, and enable successful adoption of cutting-edge 3DIC technologies.

Key Responsibilities

- Drive technical engagements involving 3DIC implementation and system-level signoff methodologies.
- Partner with R&D; to define, validate, and enhance next-generation product capabilities.
- Develop and deploy best-practice flows for multi-die, chiplet, and advanced packaging designs.
- Analyze and debug customer designs involving implementation, timing, power, reliability, and package-aware challenges.
- Influence product roadmap through customer feedback, competitive insights, and technology trends.
- Mentor internal teams and serve as a technical authority for strategic customer engagements.

Required Expertise Candidates should demonstrate deep expertise in both :





- 3DIC Implementation
- Multi-die/chiplet integration
- Floorplanning and partitioning
- Physical design closure
- Package-aware implementation
- Advanced packaging methodologies
- 3DIC System Signoff
- Timing signoff
- Power integrity and EMIR
- Reliability signoff
- Package-die co-analysis
- Signoff closure for advanced-node designs

Desired Exposure Working knowledge of one or more MultiPhysics domains:
- Thermal analysis
- Electro-thermal analysis
- Package reliability and warpage

Preferred Background
- 15+ years in semiconductor design, EDA, product engineering, or signoff methodologies.
- Strong experience with advanced-node SoCs, chiplets, HBM, 2.5D/3DIC, or advanced packaging technologies.

Ideal Candidate A hands-on technical leader who has successfully driven 3DIC implementation and signoff for production silicon , understands emerging chiplet ecosystems, and can bridge customer challenges with product innovation while maintaining solid technical depth as an individual contributor.

📌 Architect – 3DIC Compiler & System Signoff (Bengaluru)
🏢 Synopsys
📍 Bengaluru