As an SI Interconnect Engineer, you will work at the intersection of mechanical design and electrical performance. You will support the development of next-generation interconnect solutions (such as USB-C, HFM, and HS-Max) by using advanced 3D electromagnetic (EM) simulation tools and high-frequency lab equipment. Your goal is to ensure that Molex products maintain signal integrity across demanding automotive and data center environments.
Our Team
Molex CMS Networking team is a leader in Interconnect in providing connectivity solutions in Automotive industry in the area of high speed. In this role, you aren't just placing components; you are designing the components that make contemporary technology possible. You will gain exposure to:
Automotive high-speed links (Self-driving car data backbones).
Automotive Ethernet, Ser, Deser and other systems
Complex Material Science (How different plastics and plating affect signals).
What You Will Do
3D EM Simulation & Modeling
Full-Wave Modeling:
Assist in creating high-fidelity 3D models of connectors and cable terminations using Ansys HFSS or CST Studio Suite.
Virtual Prototyping: Run simulations to extract S-parameters and identify impedance discontinuities within the connector pin-field and mating interface.
Optimization: Perform "what-if" analyses on mechanical variables (e.g., pin geometry, plastic dielectric constants, shield spacing) to optimize return loss and crosstalk.
Lab Validation & Characterization
High-Frequency Measurement: Use Vector Network Analyzers (VNA) and Time Domain Reflectometers (TDR) to characterize physical prototypes up to 20 GHz or higher.
Fixture De-embedding: Learn and apply de-embedding techniques (like AFR or TRL) to remove the effects of test boards, isolating the performance of the connector itself.
Correlation: Compare lab measurement data against simulation models to validate accuracy and refine simulation methodologies.