Layer Layup & Alignment: Precisely stack inner cores, prepreg, and copper foils using registration pins to ensure perfect alignment.
Machine Operation: Load and unload heavy steel plates and panels into large industrial bonding presses.
Parameter Control: Program and monitor accurate temperature, pressure, and vacuum profiles to melt and cure the resin without causing warping or air voids.
Quality Inspection: Inspect bonded panels for defects, delamination, or misregistration using measurement tools and visual checks.
Key Requirements & Skills
Experience: 1–3 years in electronics manufacturing or printed circuit board fabrication.
Technical Knowledge: Understanding of PCB stack-ups, material properties, and lamination profiles.
Dexterity & Detail Orientation: High level of hand-eye coordination and attention to detail for handling fragile copper foils and insulating sheets.
Physical Stamina: Ability to lift heavy steel press plates and stand for extended periods.
📌 Team Leader (Gandhinagar)
🏢 PCB Power India
📍 Gandhinagar
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