Role Overview: SME - Solder Paste Printer & Reflow Soldering is responsible for overseeing, optimizing & continuously improving processes to ensure on-time manufacturing with high quality of all ISP Products. The role is accountable for process yield, reliability, cost saving while building strong cross functional alignment with NPI & TD, equipment, quality and customer teams.

Responsibilities: Technology &

• Process Setup Manage &

• Optimization of SMT Production Processes of Solder Paste Printing , Inspection &

• Reflow. Define and maintain all process windows, control plans &

• CTQ across all products of SPP , SPI &

• Reflow. Setup, Operate, Programming, Optimizing SPP &

• Reflow Soldering machines. Setup &

• Validation of Stencils, Squeegees, Solder Paste types &

• Printing parameters. Develop & validate thermal profiles for new & existing PCB assemblies.

Stencil

Design &

• Validation. Conduct DOE &

• Process validation for current products and materials. Setup , Monitor &

• Control critical reflow parameters (Zone temp., Conveyor Speed, Soak time, Peak temp.) New Model Readiness Develop &

• Maintain Process documentation, WIs &

• SOPs (SPP, SPI &

• Reflow) All new models trail pre-readiness (EVT/ DVT / PVT) , new model trail activities including trial builds & process validation. Partner with NPI, TDG to ensure DFMEA and PFMEA of SPP,SPI &

• Reflow (related to soldering & thermal constraints ) Ensure proper solder paste reflow per component and PCB design requirements Ensure smooth technology transfer from development to production. Own ramp-up metrics: yield learning curve, cycle time, scrap reduction.

Quality Excellence

Accountable for first pass yield, final yield and field reliability. Lead root cause analysis for yield excursions using SPI data , SPC charts , Yield Trends ,FMEA, DOE and failure analysis. Monitor production yield , defect rates , cycle time and implement corrective / preventive actions.

Collaborate with Quality , NPI & Customer to resolve manufacturing & Quality issues such as tombstoning , voiding , bridging , cold joints and solder balls Partner with Quality team to address customer returns, audits and escalations.

Monitor

Process parameters ( temp. Zones , conveyor speedsoak time etc ) Analyze & control print defects ( Insufficient / excess paste , smearing , bridging , skips , misalignment) Analyze soldering defects ( tombstoning , voids , cold joints , bridging etc ) and implement corrective actions Operational Excellence & Cost Optimization Own cost of ownership and productivity improvement initiatives.

Drive

Cycle time and line balancing improvements. Lead process development , validation & continuous improvement initiatives ( Kaizen , Poka yoke , Lean Manufacturing ) To ensure Proper line setup , programming , Program version management ( SPP , SPI &

• Reflow ) To ensure compliance with ESD , Safety&

• IPC standards. Analyze process data ,



SPC reports to identify trends & improvement opportunities. Customer &

• Stakeholder Engagement Serve as a technical team member for customers on PCBA Soldering process topics. Will be technical team member for customer reviews, technology discussions and risk mitigation plans. Key Deliverables &

• KPI First Pass Yield Yield and Reliability Performance Productivity Improvement Cost Optimization Customer satisfaction and audit outcomes.

Education Qualifications Bachelor in related Engineering Discipline (Preferred Electronics Engineering) 10-12 years’ hands on experience in SMT industry in a similar role ( Paste Printing , Inspection & lead free soldering processes ) Experience in high volume manufacturing workplace. Hands on knowledge of SPP machines ( MPM Momentum / ASM Dek / Ekra / GKG / Fuji / Panasonic ) Hands on experience with SMT reflow ovens with vacuum / without vacuum ( Heller / Ersa Rehm / Vitronics Soltec etc ) Familiar with thermal profilers ( KIC , Datapaq , ECD etc ) Deep Understanding of solder paste behaviour & thermal profiling Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE ) Strong knowledge on Stencil designing (Thickness , aperture , step up / down stencils ) Familiar with Lean manufacturing Role Overview: SME - Solder Paste Printer & Reflow Soldering is responsible for overseeing, optimizing & continuously improving processes to ensure on-time manufacturing with high quality of all ISP Products. The role is accountable for process yield, reliability, cost saving while building strong cross functional alignment with NPI & TD, equipment, quality and customer teams.

Responsibilities: Technology &

• Process Setup Manage &

• Optimization of SMT Production Processes of Solder Paste Printing , Inspection &

• Reflow. Define and maintain all process windows, control plans &

• CTQ across all products of SPP , SPI &

• Reflow. Setup, Operate, Programming, Optimizing SPP &

• Reflow Soldering machines. Setup &

• Validation of Stencils, Squeegees, Solder Paste types &

• Printing parameters. Develop & validate thermal profiles for new & existing PCB assemblies.

Stencil

Design &

• Validation. Conduct DOE &

• Process validation for new products and materials. Setup , Monitor &

• Control critical reflow parameters (Zone temp., Conveyor Speed, Soak time, Peak temp.) New Model Readiness Develop &

• Maintain Process documentation, WIs &

• SOPs (SPP, SPI &

• Reflow) All new models trail pre-readiness (EVT/ DVT / PVT) ,



new model trail activities including trial builds & process validation. Partner with NPI, TDG to ensure DFMEA and PFMEA of SPP,SPI &

• Reflow (related to soldering & thermal constraints ) Ensure proper solder paste reflow per component and PCB design requirements Ensure smooth technology transfer from development to production. Own ramp-up metrics: yield learning curve, cycle time, scrap reduction.

Quality Excellence

Accountable for first pass yield, final yield and field reliability. Lead root cause analysis for yield excursions using SPI data , SPC charts , Yield Trends ,FMEA, DOE and failure analysis. Monitor production yield , defect rates , cycle time and implement corrective / preventive actions.

Collaborate with Quality , NPI & Customer to resolve manufacturing & Quality issues such as tombstoning , voiding , bridging , cold joints and solder balls Partner with Quality team to address customer returns, audits and escalations.

Monitor

Process parameters ( temp. Zones , conveyor speedsoak time etc ) Analyze & control print defects ( Insufficient / excess paste , smearing , bridging , skips , misalignment) Analyze soldering defects ( tombstoning , voids , cold joints , bridging etc ) and implement corrective actions Operational Excellence & Cost Optimization Own cost of ownership and productivity improvement initiatives.

Drive

Cycle time and line balancing improvements. Lead process development , validation & continuous improvement initiatives ( Kaizen , Poka yoke , Lean Manufacturing ) To ensure Proper line setup , programming , Program version management ( SPP , SPI &

• Reflow ) To ensure compliance with ESD , Safety&

• IPC standards. Analyze process data , SPC reports to identify trends & improvement opportunities. Customer &

• Stakeholder Engagement Serve as a technical team member for customers on PCBA Soldering process topics. Will be technical team member for customer reviews, technology discussions and risk mitigation plans. Key Deliverables &

• KPI First Pass Yield Yield and Reliability Performance Productivity Improvement Cost Optimization Customer satisfaction and audit outcomes.

Education Qualifications Bachelor in related Engineering Discipline (Preferred Electronics Engineering) 10-12 years’ hands on experience in SMT industry in a similar role ( Paste Printing , Inspection & lead free soldering processes ) Experience in high volume manufacturing environment. Hands on knowledge of SPP machines ( MPM Momentum / ASM Dek / Ekra / GKG / Fuji / Panasonic ) Hands on experience with SMT reflow ovens with vacuum / without vacuum ( Heller / Ersa Rehm / Vitronics Soltec etc ) Familiar with thermal profilers ( KIC , Datapaq , ECD etc ) Deep Understanding of solder paste behaviour & thermal profiling Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE ) Strong knowledge on Stencil designing (Thickness , aperture , step up / down stencils ) Familiar with Lean manufacturing

📌 Process Engineering (Jagiroad)
🏢 Tata Electronics Private
📍 Jagiroad