Role Overview

SME - Solder Paste Printer &

- Reflow Soldering is responsible for overseeing, optimizing & continuously improving processes to ensure on-time manufacturing with high quality of all ISP Products.

The role is accountable for process yield, reliability, cost saving while building solid cross functional alignment with NPI &

- TD, equipment, quality and customer teams.

Responsibilities

- Technology &
- Process Setup

- Manage &

- Optimization of SMT Production Processes of Solder Paste Printing , Inspection &
- Reflow.

- Define and maintain all process windows, control plans &

- CTQ across all products of SPP , SPI &
- Reflow.

- Setup, Operate, Programming, Optimizing SPP &

- Reflow Soldering machines.

- Setup &

- Validation of Stencils, Squeegees, Solder Paste types &
- Printing parameters.

- Develop & validate thermal profiles for new & existing PCB assemblies.

- Stencil Design &

- Validation.

- Conduct DOE &

- Process validation for new products and materials.

- Setup , Monitor &

- Control critical reflow parameters

(Zone temp., Conveyor Speed, Soak time, Peak temp.)

- New Model Readiness

- Develop &
- Maintain Process documentation, WIs &
- SOPs (SPP, SPI &
- Reflow)

- All new models trail pre-readiness (EVT/ DVT / PVT) , new model trail activities including trial builds & process validation.

- Partner with NPI, TDG to ensure DFMEA and PFMEA of SPP,SPI &

- Reflow (related to soldering & thermal constraints )

- Ensure proper solder paste reflow per component and PCB design requirements

- Ensure smooth technology transfer from development to production.

- Own ramp-up metrics:



yield learning curve, cycle time, scrap reduction.

- Quality Excellence

- Accountable for first pass yield, final yield and field reliability.

- Lead root cause analysis for yield excursions using SPI data , SPC charts , Yield Trends ,FMEA, DOE and failure analysis.

- Monitor production yield , defect rates , cycle time and implement corrective / preventive actions.

- Collaborate with Quality , NPI &

- Customer to resolve manufacturing &
- Quality issues such as tombstoning , voiding , bridging , cold joints and solder balls

- Partner with Quality team to address customer returns, audits and escalations.

- Monitor Process parameters ( temp. Zones , conveyor speedsoak time etc )

- Analyze & control print defects ( Insufficient / excess paste , smearing , bridging , skips , misalignment)

- Analyze soldering defects ( tombstoning , voids , cold joints , bridging etc ) and implement corrective actions

- Operational Excellence &

- Cost Optimization

- Own cost of ownership and productivity improvement initiatives.

- Drive Cycle time and line balancing improvements.

- Lead process development , validation & continuous improvement initiatives ( Kaizen , Poka yoke , Lean Manufacturing )





- To ensure Proper line setup , programming , Program version management ( SPP , SPI &

- Reflow )

- To ensure compliance with ESD , Safety&

- IPC standards.

- Analyze process data , SPC reports to identify trends & improvement opportunities.

- Customer &

- Stakeholder Engagement

- Serve as a technical team member for customers on PCBA Soldering process topics.

- Will be technical team member for customer reviews, technology discussions and risk mitigation plans.

Key Deliverables &

- KPI

- First Pass Yield

- Yield and Reliability Performance

- Productivity Improvement

- Cost Optimization

- Customer satisfaction and audit outcomes.

Education Qualifications

- Bachelor in related Engineering Discipline (Preferred Electronics Engineering)

- 10-12 years’ hands on experience in SMT industry in a similar role ( Paste Printing , Inspection & lead free soldering processes )

- Experience in high volume manufacturing environment.

- Hands on knowledge of SPP machines ( MPM Momentum / ASM Dek / Ekra / GKG / Fuji / Panasonic )

- Hands on experience with SMT reflow ovens with vacuum / without vacuum ( Heller / Ersa Rehm / Vitronics Soltec etc )

- Familiar with thermal profilers ( KIC , Datapaq , ECD etc )

- Deep Understanding of solder paste behaviour & thermal profiling

- Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE )

- Strong knowledge on Stencil designing (Thickness , aperture , step up / down stencils )

- Familiar with Lean manufacturing

📌 Process Engineering (Mayang)
🏢 Tata Electronics
📍 Mayang