Principal, IC Package Engineer (Bengaluru)

Principal, IC Package Engineer (Bengaluru)

10 Aug
|
Microchip Technology
|
Bengaluru

10 Aug

Microchip Technology

Bengaluru

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B) global organization? We offer all that and more at Microchip Technology Inc.
People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission,



and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.
Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a outstanding team dedicated to empowering innovation. People like you.
Visit our careers page to see what exciting opportunities and company perks await
Job Description:
The Mixed Signal Development Group is responsible for delivering high-speed analog and mixed-signal IP to divisions within Microchip. We work with leading edge CMOS processes to produce analog integrated circuits for wireline applications. From PCIe to 128+Gb/s SERDES, we enable technology that allows Microchip’s products to interface to the outside world.
As a member of the Mixed-Signal Development Group, the candidate will be supervised by a team manager, and be engaged in the package design and layout.
Responsibilities:
Conduct pa

📌 Principal, IC Package Engineer (Bengaluru)
🏢 Microchip Technology
📍 Bengaluru

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