We have a requirement for thermal simulation and find the JD below
Thermal Simulation for the characterization and development of power modules Flip chip BGA wire bond on package, board, and system level
Generation of simulation and compact models for end customers.
Thermal virtual prototyping and simulation-based product optimization.
Thermal consulting of internal customers from development and application; close interaction with customers from a problem statement to simulation results interpretation and delivery.
Working in close exchange with the multi-cultural team.
A degree in Mechanical / Electronics Engineering, Physics, or a similar field
At least 3-5 years of professional experience in thermal FEM/ CFD simulations
Very valuable hands-on experience with Ansys workbench, Icepak, AEDT
Knowledge in creating and modifying 3D CAD geometries for simulation.