IC Packaging Staff Engineer (Bengaluru)

IC Packaging Staff Engineer (Bengaluru)

10 Aug
|
Qualcomm
|
Bengaluru

10 Aug

Qualcomm

Bengaluru

Company:
Qualcomm India Private Limited
Job Area:
Engineering Group, Engineering Group > Hardware Engineering
General Summary:
We are looking for a highly motivated packaging engineer capable of leading state-of-the-art advanced IC packaging development and new product introduction of leading-edge package technologies for AI, Mobile, Bluetooth, WiFi, IoT, Power Management, Connectivity Automotive and recent emerging markets and driving that innovation into high volume manufacturing in assembly suppliers. Extensive knowledge and experience in Flip Chip, Wire bond and System in Package assembly process, materials, and equipment are required. The position also requires the ability to lead multi-functional teams and solve complex technical problems in working with multiple OSATs. Experience or worked on projects with Wafer-on-Wafer bonding is a plus.
Minimum Qualifications:
• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
OR
Master's degree in Computer Science,



Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
Duties and Responsibilities:
Responsible for exploring, development and HVM deployment of FCCSP, FCBGA, and/or SiP/Module packaging technologies.
Responsible for initiating & defining package process flow, material set/ BKM, test vehicle, DOEs & cornering, process control plans to successfully develop manufacturable and reliable products.
Interface with OSATs, substrate/ material suppliers, and tool makers in developing technology related to product requirements. Align with internal product teams on Design Rule and its establishment.
Associate with internal design team and drive DFM methodology for new technolo

📌 IC Packaging Staff Engineer (Bengaluru)
🏢 Qualcomm
📍 Bengaluru

Reply to this offer

Impress this employer describing Your skills and abilities, fill out the form below and leave Your personal touch in the presentation letter.

Subscribe to this job alert:

Get the latest job offers by email for: ic packaging staff engineer (bengaluru) / bengaluru

Subscribe to this job alert:

Get the latest job offers by email for: ic packaging staff engineer (bengaluru) / bengaluru