Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
This role is within Micron’s Package Development Engineering (PDE) group, a global organization with teams in the United States, Singapore, Malaysia, China, Taiwan, and India. As a Package Device Product Engineer (PDPE), you will support new DRAM, NAND, or managed NAND (mNAND) products by coordinating resources, test readiness, and analysis throughout the product lifecycle. You will perform data analysis and modeling, create and maintain root cause analysis documentation, analyze parametric,
front-end (FE) probe, and back-end (BE) electrical test data, and respond to product failures.
Responsibilities and Tasks
- Enable new BE test signals to capture assembly-related failures.
- Collaborate with Test Solution Engineering (TSE) and Product Engineering (PE) to ensure standardized test coverage and characterization, define characterization limits, and approve test-related changes.
- Develop and sustain current out-of-control action plans (OCAPs).
- Provide lot disposition recommendations based on parametric data observations when out-of-control (OOC) conditions are triggered.
- Ensure silicon and assembly processes meet product requirements by analyzing probe and BE test data.
- Participate in phase gate review meetings by presenting data analysis and supporting phase gate exit decisions related to electrical test data.
- Analyze test failures, coordinate EFA and PFA activities