IC Package Design Engineer (India)

IC Package Design Engineer (India)

12 Aug
|
Analogue Insight
|
India

12 Aug

Analogue Insight

India

Description

THE COMPANY
Established in early 2024, at Analogue Insight we are bridging the Analogue and Digital Worlds for Tomorrow through our Chiplet Solutions. Our core expertise lies in developing cutting-edge Chiplet technology that serves as the building block for advanced communication systems. Our Chiplets are designed to offer high performance, scalability, and integration flexibility, enabling our clients to achieve breakthroughs in computation speed, data processing, and connectivity. For more information about us, check out our website (Analogue Insight) and LinkedIn Page (Analogue Insight™: Overview | LinkedIn).

THE ROLE
We are seeking a highly skilled and experienced IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a rapid-growing startup environment. This role is designed for a senior technologist who combines deep hands-on expertise with system-level thinking, and who thrives in high-ambiguity, high-impact settings.

You will define and drive high-performance,



low-power packaging architectures spanning 2D and RDL based fan-out (2.5D), chiplet-based designs, and heterogeneous integration, leading efforts from early technology path finding through production ramp. You will work closely with foundries, OSATs, substrate suppliers, and internal cross-functional teams to shape both product execution and long-term packaging strategy.
Hiring Manager: Christian Borelli, Founder and CSO.

KEY RESPONSIBILITIES
- Serve as technical authority for IC and SiP packaging across multiple products and programs.
- Own package architecture and technology roadmap, aligned with product, cost, and scalability goals.
- Lead chiplet-based packaging strategies, including UCIe, silicon interposers, 3D stacked die solutions, and advanced RDL.
- Perform and guide hands-on package design and physical layout, including critical structures for High-speed SerDes/PHY (PCIe, CXL), LPDDR5, UCIe, and Other mul

📌 IC Package Design Engineer (India)
🏢 Analogue Insight
📍 India

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