Failure Analysis Engineer | Base location in India and who can travel/work in Taiwan. Job Description: Perform the full range of activities in Failure Analysis for customer-returned failure ICs; Discuss and fully comprehend the customer failure mode, type and rate from CQE/FAE using the CRA form, and ensure customer failure mode has been verified on the bench by the FAE; Carry out non-destructive analysis such as external package inspection using optical microscopy, continuity checks using digital multimeters or IV curve tracing, X-ray inspection, CSAM, and others where necessary; Rework failure units through cleaning and re-balling for WLCSPs; Perform electrical retest of the failure units on the ATE; Work with Engineering to understand the parametric or functional failure items from the ATE retest; Carry out further non-destructive verification of the failure mode if necessary, including bench test using EVBs; Prepare and submit interim 4D/FAR and 8D/CAR to Sales/FAE as an update of the progress for the FA; Develop the Destructive FA plan that includes Decapsulation, Delayering,
High-power OM and SEM, FIB, Cross-sectioning and other analysis techniques by coordinating such work with 3rd party labs. Generate, communicate and submit final 4D/FAR and 8D/CAR to Sales/FAE in a timely manner; Work closely with SQE on assembly-related quality issues and PE/DE on design-related failures; Manage customer complaints by working closely with CQE/SQE and subcontractors on the required action items; Submit and present FA updates during weekly TQM review meeting; Perform any other tasks that are assigned by the Supervisor as and when required; and Be an active TQM member by contributing knowledge and value to the team. Position Requirements: 1-5 years of work experience in analog/power IC companies Knowledge of Failure Analysis and FA techniques, including EFA, NDA, DFA and Fault Isolation Valuable Understanding of semiconductor device physics and IC packaging technologies will be f