HCP Technologies is a Bengaluru-based provider of advanced capital equipment for the Semiconductor, PCB/SMT, Electronics, 3D Printing, EV Battery, and Automotive industries — serving research and manufacturing clients across India.
We're looking for a hands-on Field Services Engineer to install, commission, and maintain equipment at customer sites, including IC decapsulation systems, wire bonders, die bonders, LPCVD furnaces, deposition systems etc.,
You'll be responsible for:
On-site installation, commissioning & calibration
Troubleshooting, repairs & technical support
Preventive maintenance & service scheduling
Customer training & relationship management
Service documentation & escalation coordination
What we're looking for:
Diploma/B.E./B.Tech in Electronics, Electrical, Mechanical, Mechatronics, or related field
Hands-on experience with semiconductor, electronics, or industrial capital equipment (highly preferred)
Robust troubleshooting skills — able to read schematics, use diagnostic tools & interpret manuals
Willing to travel across India; comfortable in cleanroom/lab environments
Clear communication in English (local language knowledge a plus)