HCP Technologies is a Bengaluru-based provider of advanced capital equipment for the Semiconductor, PCB/SMT, Electronics, 3D Printing, EV Battery, and Automotive industries — serving research and manufacturing clients across India.
We're looking for a hands-on Field Services Engineer to install, commission, and maintain equipment at customer sites, including IC decapsulation systems, wire bonders, die bonders, LPCVD furnaces, deposition systems etc.,
You'll be responsible for:
- On-site installation, commissioning & calibration
- Troubleshooting, repairs & technical support
- Preventive maintenance & service scheduling
- Customer training & relationship management
- Service documentation & escalation coordination
What we're looking for:
- Diploma/B.E./B.Tech in Electronics, Electrical, Mechanical, Mechatronics, or related field
- Hands-on experience with semiconductor, electronics, or industrial capital equipment (highly preferred)
- Robust troubleshooting skills — able to read schematics, use diagnostic tools & interpret manuals
- Willing to travel across India; comfortable in cleanroom/lab environments
- Clear communication in English (local language knowledge a plus)