Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.
Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.
Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’
Responsibilities:
Responsible for Product testing at Wafer and Package level for different type of devices.
Off load the test from the customer and run production test.
Strong in Updating the test program/LB/Probe card based on the ECN changes.
Expert with OSAT process for Product test.
Yield optimization, lot Deposition with Customer and Fab.
Single site to Multisite conversions.
Test Cost reduction, Test time optimization.
Build additional test HW.
Sound knowledge on Digital, Mixed signal, RF test methodologies. Experience in developing the test programs in ATE environment for Digital, mixed signal, RF devices.
Device debug for Digital, Mixed Signal, RF devices using ATE tools and verify with bench Test results.
Responsible for working with different teams for understanding the device datasheet and come up with a detailed Test procedure/plan to test the chip in ATE workplace.
Strong working experience in Teradyne test systems like ETS(364/88/800), UltraFlex, J750, Magnum, Advantest V93K systems or any other ATE Tester.
Knowledge on ATE hardware design (load board & prob