Field Application Engineer — Electronic Systems Design (Bengaluru)

Field Application Engineer — Electronic Systems Design (Bengaluru)

13 Aug
|
GSAS Micro Systems
|
Bengaluru

13 Aug

GSAS Micro Systems

Bengaluru

The Role

As a Field Application Engineer — Electronic Systems Design, you will be the technical authority for GSAS's PCB design and manufacturing preparation portfolio. You'll work with hardware design teams, signal integrity engineers, manufacturing/NPI groups, and engineering managers across automotive, aerospace, defense, industrial, medical, and telecom sectors to help them evaluate, deploy, and get the most out of professional and enterprise-grade EDA tools — from schematic capture and constraint-driven layout through signal/power integrity analysis, DFM validation, and manufacturing handoff.

This role spans the full board-level design chain. You'll support customers using enterprise PCB design platforms for complex multi-layer, high-speed boards as well as teams on professional-tier tools who are stepping up from free or entry-level environments. You'll also work with manufacturing engineers and NPI teams on design-to-factory readiness — DFM analysis, test point optimization, panelization, and ODB++/Gerber validation.



The common thread is that you understand what it takes to turn a schematic into a functioning, manufacturable board.

Key Responsibilities

Deliver technical demonstrations, evaluations, and proof-of-concept engagements across the full PCB portfolio — enterprise-grade schematic capture and constraint-driven layout for complex designs, qualified-tier design tools for small teams and independent engineers, integrated signal integrity and power integrity analysis, and manufacturing preparation and DFM/DFA validation tools.

Guide customers through real design challenges at the board level — controlled impedance stackup design for DDR4/DDR5 and PCIe Gen3/Gen4/Gen5, differential pair routing and length matching, power delivery network optimization, via stub management and back-drilling decisions for high-frequency designs, rigid-flex definition, and design rule configuration for IPC Class 2 and Class 3 reliability requirements.

Run SI/PI analysi

📌 Field Application Engineer — Electronic Systems Design (Bengaluru)
🏢 GSAS Micro Systems
📍 Bengaluru

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