About role:

Are you passionate about semiconductor packaging and advanced package substrate design? Join our team and work on cutting-edge technologies supporting next-generation high-performance computing, networking, AI, and consumer semiconductor products.

Key Responsibilities
- Design and develop
IC package substrate
s for advanced semiconductor packages (FCBGA, FCCSP, SiP, Flip-Chip)
- Create substrate layouts including
bump maps, ball maps, stack-ups, escape routing, and high-speed signal routing
- Perform package routing while considering
Signal Integrity (SI), Power Integrity (PI), and manufacturabilit
y
- Collaborate with cross-functional teams including IC, PCB, SI/PI, mechanical, and manufacturing engineers
- Generate fabrication outputs and ensure design compliance through DRC and design reviews

Required Skills
- Experience i
n IC Package Substrate Desi




gn and package layouts
- Hands-on expertise wit
h Cadence Allegro Package Designer (AP
D) o
r AP
D+
- Strong knowledge o
f FCBGA, FCCSP, Flip-Chip, Wire Bond, S
iP, and substrate technologies
- Valuable understanding o
f Signal Integrity (SI), Power Integrity (PI), P
DN, and package manufacturing processes
- Familiarity with interfaces such a
s DDR/LPDDR, PCIe, USB, Ethernet, SerDes, or H
BM is preferred
.

Preferred Qualifications
- Bachelor's or Master's degree in Electronics, Electrical Engineering, VLSI, or a related fie
- 7+ years of experience in semiconductor package substrate design
- Strong analytical, debugging, and communication skills

📌 IC package substrate Design (Bengaluru)
🏢 BayOne Solutions
📍 Bengaluru