Assembly Process Engineering Manager – Semiconductor Packaging (Ahmedabad)

Assembly Process Engineering Manager – Semiconductor Packaging (Ahmedabad)

13 Aug
|
Best NanoTech
|
Ahmedabad

13 Aug

Best NanoTech

Ahmedabad

Assembly Process Engineering Manager Semiconductor Packaging

Location:
Ahmedabad, Gujarat, India

Work Mode:
Onsite

Employment Type:
Full-Time

Experience:
12 18 Years

Industry:
Semiconductor / ATMP / OSAT / IC Packaging

Role Overview

We are looking for an Assembly Process Engineering Manager to lead semiconductor packaging-process engineering in a high-volume ATMP/OSAT manufacturing environment. The role will own process development, qualification, production ramp-up, process stability, yield improvement and engineering-team performance.

The position requires hands-on expertise in die preparation, die attach, wire bonding, molding, marking and package singulation, along with proven experience leading cross-functional engineering programs.

Key Responsibilities
- Lead the assembly process-engineering team supporting high-volume semiconductor packaging operations.
- Own process performance across wafer preparation, die attach, wire bonding, molding, marking and singulation.
- Develop and optimize process recipes, process windows, control plans and operating procedures.




- Lead process characterization, equipment qualification and production release activities.
- Drive new-product introduction, package qualification and transfer into volume manufacturing.
- Execute DOE, SPC and process-capability studies to improve yield and process stability.
- Monitor defect trends, scrap, rework, process excursions and critical manufacturing parameters.
- Lead root-cause analysis and corrective actions for process, material, equipment and package-quality issues.
- Collaborate with equipment engineering to improve equipment capability, uptime and repeatability.
- Work with product engineering, quality, reliability and manufacturing teams to meet production targets.
- Qualify current assembly materials, consumables, suppliers and process changes.
- Develop PFMEA, control plans, OCAPs, 8D reports and CAPA actions.
- Reduce process variation, manufacturing cycle time, scrap and cost o

📌 Assembly Process Engineering Manager – Semiconductor Packaging (Ahmedabad)
🏢 Best NanoTech
📍 Ahmedabad

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