Tata Electronics Pvt. Ltd. is a prominent global player in the electronics manufacturing industry, with quick-emerging capabilities in Electronics Manufacturing Services, Semiconductor Assembly & Test, Semiconductor Foundry, and Design Services. Established in 2020 as a greenfield venture of the Tata Group, the company aims to serve global customers through integrated offerings across a trusted electronics and semiconductor value chain.
Job Summary
We are seeking an Experienced Intrinsic FEOL (Front End of Line) Reliability Engineer to drive reliability engineering activities essential for ensuring the long-term performance and robustness of advanced semiconductor devices manufactured at our world-class foundry in Dholera, Gujarat. This role is pivotal in establishing our fab’s reputation for delivering highly reliable, quality products for the most demanding applications.
The successful candidate will work closely with device engineering, process integration, module engineering, and quality teams to develop, execute, and monitor intrinsic FEOL reliability programs,
ensuring compliance with industry standards and customer requirements. Early phases will involve technology qualification and fab ramp-up, transitioning to sustaining and continuous improvement over time.
Key Responsibilities
Intrinsic FEOL Reliability Program Development
Define, develop, and implement intrinsic reliability strategies, design of test structures and test plans for FEOL process technologies across multiple technology nodes (sub-micron, nanometer, etc.).
Establish and drive FEOL reliability stress methodologies and process qualifications for mechanisms such as:
TDDB (Time-Dependent Dielectric Breakdown)
NBTI/PBTI (Negative/Positive Bias Temperature Instability)
HCI (Hot Carrier Injection)
BTI (Bias Temperature Instability)
SILC (Stress Induced Leakage Current)
Charge trapping, oxide breakdown, and other FEOL-specific wear-out mechanisms
Collaborate with R&D;, device, and process integration